Metrology CFA

Metrology at SEMICON West 2027
 

Advanced Analytical Techniques for Semiconductor Manufacturing

As semiconductor processes become increasingly sensitive to trace-level impurities and material variability, conventional analytical approaches are often no longer sufficient. This technical session will bring together experts in analytical chemistry, materials characterization, contamination control, and instrumentation to address some of the most challenging measurement needs across the semiconductor manufacturing ecosystem.

Attendees will gain practical insights into how advanced analytical methods can improve material qualification, accelerate troubleshooting, strengthen process control, and support manufacturing reliability. The session will highlight the latest measurement capabilities for detecting and quantifying contaminants at increasingly demanding levels, while addressing real-world challenges involving complex formulations, corrosive environments, and sensitive wafer surfaces.
 

TOPICS:

• Precise Assay Measurement of Multicomponent Formulated Cleans and CMP Slurries
  • Advanced approaches for accurately characterizing complex formulations to improve material consistency, qualification, and process performance.
• Measurement of Airborne Molecular Contamination (AMC)
  • Sensitive techniques for identifying molecular contaminants and enabling earlier detection of contamination risks before they impact critical processes.
• Analysis of Trace Metals in Deposition Materials and Liquid Chemicals
  • Methods for detecting ultratrace metallic impurities to support tighter material specifications and more robust supplier qualification.
• Analysis of Trace Metals in Corrosive Gases
  • Analytical strategies for measuring trace metals in highly reactive gas environments while maintaining reliable, actionable results for process and gas-quality control.
• Measurement of Organics and Nanoparticles on Wafer Surfaces
  • Advanced surface-analysis techniques for detecting trace organic residues and linking contamination to potential process defects and cleaning challenges.
• New Analytical Methods and Instrumentation
  • Emerging technologies offering greater sensitivity, selectivity, speed, and automation to expand analytical capabilities and shorten time to actionable results.
     

IMPORTANT INFORMATION & 2027 DEADLINES
 

QUESTIONS?

Contact Laura Nguyen
[email protected]

SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

• Speaker agreement
• Headshot and short bio (<500 words)
• PowerPoint slide presentation (16:9 format)
• PDF for distribution to attendees
• Identify a replacement speaker if unable to attend