2027 Call for Abstracts Opens September 28

Flexible Hybrid Electronics at SEMICON West 2027

Flexible Hybrid Electronics (FHE) is redefining how electronic systems are designed and deployed across robotics, intelligent sensing, and wearable technologies. By integrating semiconductor components with printed manufacturing and flexible substrates, FHE enables lightweight, conformal systems capable of real-time sensing and processing.

This session explores additive manufacturing, heterogeneous integration, and embedded AI to realize next-generation electronic systems. We invite abstracts that address the design, scalability, and deployment of these technologies across industrial and consumer landscapes.

TOPIC AREAS

We encourage submissions demonstrating innovations in intelligent robotics, distributed sensing, and IoT. Key areas of focus include: 

  • Manufacturing & Integration: Additive manufacturing, high-density interconnects, multilayer circuits, and advanced packaging for flexible systems.
     
  • Materials & Power: Next-generation conductive inks, flexible substrates, energy harvesting, and power management for autonomous operation.
     
  • High-Performance Comms: Integrated photonics, 5G/mmWave integration, and ruggedized designs for harsh environments (aerospace/automotive). 
     
  • Intelligent Applications: 
    • Healthcare: Wearable sensing platforms enabling conformal telemetry and continuous health monitoring.
    • Digital Integration: Embedded AI and digital twins for FHE systems. 
    • Robotics: Soft robotics, tactile sensing, and human-machine interfaces.
       

IMPORTANT INFORMATION & 2027 DEADLINES

Deadlines

Information

Sept 28

Call for Abstracts Open

Nov 23

Abstract Submissions Deadline

TBC

Author and Speaker Notification

TBC

Speaker Portal Tasks Due

TBC

Draft Presentation for Review

  TBC  

  Final PPT Due (16:9 display format) and PDF Versions  

 

QUESTIONS?

Contact Gity Samadi
Sr. Director, R&D, SEMI 
[email protected] 

 

SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend