CFA Submission Deadline November 23, 2026
SUBMIT HERE!

Call for Abstracts for Speakers

Advanced Packaging & Heterogeneous Integration Summit at SEMICON West 2027

TOPIC AREAS

Session will include (but not limited to) topics within:

  • Scaling Heterogeneous Integration: From Chiplets to Systems
    • Chiplet interoperability and standards (UCIe, die-to-die interfaces, multi-vendor marketplaces)
      2.5D/3D integration and hybrid bonding (pitch scaling, yield, manufacturing readiness)
       
  • Power, Thermal and Physical Limits of AI-Era Packaging
    • Power delivery in-package (integrated VRMs, GaN, backside power delivery networks)
      Advanced thermal solutions (microfluidics, two-phase cooling, liquid-cooled packages)
      Co-design across silicon, package, and system (thermal-aware EDA, digital twins)
       
  • Photonics, Materials and Board Level Frontier
    • CPO-Co-packaged optics (optical I/O chiplets, interconnect, silicon photonics integration, fiber attach)
      Advanced materials and substrates (glass/panel substrates, liquid metals, low-loss dielectrics)
      Extending heterogeneous integration to the board level (System-on-Package, panel-to-board convergence, co-design across the package/PCB boundary
       

IMPORTANT INFORMATION & 2027 DEADLINES
 

Deadlines

Information

Oct 7

Call for Abstracts Open

Nov 23

Abstract Submissions Deadline

Jan 8

Author and Speaker Notification

Mar 15

Speaker Portal Tasks Due

 Mar 15 

  Final PPT Due (16:9 display format) and PDF Versions  

 

QUESTIONS?

Contact Gity Samadi
Sr. Director, R&D, SEMI 
[email protected] 

Pushkar Apte
Strategic Technology Advisor, SEMI
papte@semi.org 


SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend