Call for Abstracts is Now Closed

Test Vision Symposium at SEMICON West 2026


Tomorrow’s Test Vision

Semiconductor testing is evolving rapidly to keep pace with innovations in AI, advanced packaging, silicon photonics, and high-performance systems. As devices become more complex, test plays a critical role in ensuring reliability, optimizing performance, and enabling scalable manufacturing across applications from autonomous vehicles and renewable energy to AI-powered systems and next-generation consumer electronics.

Test Vision Symposium explores advancements in power and wide bandgap testing, test infrastructure, interfaces and sensors, and emerging trends such as system-level test, real-time analytics, and security. We invite abstracts that address innovative test methodologies, data-driven approaches, and solutions to challenges in AI, thermal management, and heterogeneous integration.
 

TOPIC AREAS

  • 2026 Hot Topics:
    • Silicon Photonics
    • Using AI in Metrology and Test
    • Testing AI
    • Advanced Packaging & Chiplets
    • Power Delivery
    • Thermal Management
       
  • Power / Power Delivery:
    • Co-packaging Power Processes (modules)
    • Wide Bandgap (SiC , GaN, InP) Test
    • Isolation and High Voltage Test
    • Power Test and Power Test Methods
    • Battery Management Systems (BMS) Test
    • PMIC and Power Stage Test
    • Integrated Voltage Regulation (IVR)
       
  • Test Infrastructure:
    • Wafer-level Burn-in
    • Panel Testing
    • Handling High Current in Test (Sockets, Needles, PCBs)
    • Pushing the Density of Probe Arrays
    • Advanced Handling (Robotization, High-Multi Site)
    • Data Management and Data Analytics
    • Active Thermals
    • EDA-to-ATE
    • Diagnostic Tools
    • Real-time Analytics & Control
    • Traceability and Security
       
  • Interfaces & Sensors:
    • PCIe, UCIe, MIPI, etc.
    • Sensors & Transducers (Humidity, Pressure, etc.)
    • Photonics ICs & Interconnects
    • RF (mmWave, radar, UWB, WiFi, 6G)
    • Image Sensors
    • MicroLED / OLED
       
  • Test Trends:
    • On-Die Test Agents (BIST, I-JTAG, Cache Resident Test)
    • System Level Test
    • Supporting Co-simulation
    • Post-Silicon Validation
    • Productivity Improvements (Tools)
    • Standardized Test Language
    • High Reliability ICs (Automotive, Healthcare, Consumer)
    • Impact on On-shoring
    • Test 2.0
    • Advanced Scan
    • Security

 

IMPORTANT INFORMATION & 2026 DEADLINES

Deadlines

Information

March 18

Call for Abstracts Open

June 1

Abstract Submissions Deadline

July 14

Author and Speaker Notification

July 24

Speaker Portal Tasks Due

September 15

Draft Presentation for Review

  September 29  

  Final PPT Due (16:9 display format) and PDF Versions  

 

QUESTIONS?

Contact Basak Ulutas Ozturkler
[email protected]

 

SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend