Sesh Ramaswami is Advanced Products Technology Development within the New Markets and Alliances Group at Applied Materials. In this role, Sesh is responsible for identifying inflections and developing equipment and materials engineering solutions to meet these emerging requirements in IoT / MtM devices such as CIS and Si-Photonics among others. He is a co-author and contributor of a book published by McGraw Hill, entitled 3-D IC Stacking Technology. A holder of ~40 U.S. patents, Sesh has undergraduate and graduate degrees in chemical engineering from Indian Institute of Technology, Kanpur, and Syracuse University, respectively, and an MBA. Sesh is a member of the IEEE and has been associated with the SEMI North America Packaging Committee. He is an active member and volunteer with Rotary International, with a focus on health initiatives, education and youth leadership.