Mark Gerber

Senior Director of Engineering and Marketing

Mark is Sr. Director of Engineering and Marketing of Flip Chip, Advanced Interconnect at ASE (US) Inc., and provides technical support for customer activities focused around Flip Chip, Copper Pillar and SiP Packaging Technologies. Mark has 23 years of semiconductor packaging experience working for the ASE Group, Texas Instruments, Motorola SPS and Dallas Semiconductor in various areas of manufacturing, assembly and testing of electronics components and systems, with an emphasis on new product introductions (NPI’s) and the development of new technologies and processes. Mark holds a Bachelor’s degree in Mechanical Engineering from Texas A&M University, has written +20 papers and holds over 32 semiconductor packaging patents.

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