Keith Best has held a range of semiconductor processing and applications positions for both device manufacturing and capital equipment companies for the past 28 years, of which 13 years were with ASML. He is currently the director of applications engineering at Rudolph Technologies where he supports Rudolph Technologies’ JetStep Advanced Packaging Lithography stepper. Keith holds a B.Sc. Honors Degree in materials science from the University of Greenwich, UK. He has numerous publications and holds 16 US patents in the areas of Photolithography and Process integration.