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John Lau

Senior Technical Advisor
ASM Pacific Technology

John Lau has been a senior technical advisor of ASM since 2014. With more than 39 years of R&D and manufacturing experience, John has published more than 450 peer-reviewed papers, 30 issued and pending US patents, and published 18 textbooks on flip chip technology, ball grid array technology, wafer-level chip scale package, advanced MEMS packaging, TSV technology, and 3D IC integrations.

 

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