Specialty: CMOS Logic Device Technology R&D Career: Huiming Bu has 13 years of industry experience of semiconductor logic device R&D at IBM Research after he received his Ph.D. in Electrical Engineering from Yale University. In his current role, Huiming is responsible for CMOS device technology roadmap for IBM and he oversees semiconductor research on new device architectures and new materials for logic scaling. Huiming started his technical career at IBM on High-/Metal Gate project and then drove SOI FinFET research for IBM’s 14nm technology. After that, he worked on 10nm and 7nm technology nodes in Joint Development Alliance (JDA) with various partners - aka “IBM club”, and is currently driving CMOS Technology Pathfinding R&D for IBM and JDA. Huiming has authored and co-authored more than 70 publications, and holds more than 50 US and international patents.