Bryan Black received his Ph.D. in Electrical and Computer Engineering from Carnegie Mellon. With over 25 years of experience, Black has had the honor of working at Motorola, Intel, and AMD. He has done a little of everything from devices to circuits to microarchitecture to DRAM to test to packaging to manufacturing. Currently Black is a Senior AMD Fellow responsible for AMD graphics platforms, memory systems, and packaging solutions. Recently AMD introduced its first die stacked products integrating High Bandwidth Memory (HBM) on an interposer, the AMD Radeon™ R9 Fury family of graphics products.