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Bob Sankman

Fellow, Technology and Manufacturing Group, Co-Director, Pathfinding and Assembly and Packaging Technologies for 7nm Silicon and Beyond
Intel

 Bob Sankman is an Intel Fellow and the director of package and assembly pathfinding in the Assembly Test Technology Development (ATTD) group at Intel Corporation. He is responsible for directing the definition of packaging and assembly activities for Intel’s advanced logic products. Before assuming his current role, Sankman served as the pathfinding manager for the Assembly Test Technology Development group, where he was responsible for defining packaging technology to support all Intel logic processes. Earlier in his Intel career, he managed Quality & Reliability and Failure Analysis labs, as well as Package Design, Simulation and Analytical Labs. Sankman joined Intel in 1980 as a wafer fab process engineer. Sankman has earned 50 patents in the field of electronic packaging and has been honored with three Intel Achievement Awards. He has also contributed his expertise to numerous technical papers. Sankman earned his bachelor of science degree in chemical engineering from the University of Illinois.

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