Alexa Greer is a passionate Technical Engagement Manager with over 15 years of experience in the semiconductor industry, concentrating on defect and yield management. Alexa has dedicated more than a decade of that time at KLA-Tencor, driving wafer inspection application projects with leading edge chip manufacturers, including IBM and GLOBALFOUNDRIES. As a field applications engineer, Alexa has closely collaborated with those companies to identify, detect and then solve their process issues for improved device yield. Alexa is a certified expert on KLA-Tencor’s Broadband Plasma Wafer Inspection Systems, achieving the highest level of applications training, with a focus on design and systematic defect discovery. Alexa’s advanced knowledge and novel applications have been published multiple times for the SEMI ASMC conferences, earning her the Best Paper Award in 2008. Previously, Alexa worked at Eastman Kodak Company, where she championed in-depth characterization and defect reduction efforts on CCD image sensors. She holds a B.S. degree in micro-electronic engineering from the Rochester Institute of Technology in New York.