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Three-Dimensional Stacked Integrated Circuits (3DS-IC) Committee Meeting

San Francisco Marriott Marquis Wednesday, July 12
3:00pm to 5:00pm

The Global 3DS-IC Technical Committee promotes mutual understanding and improved communication between users and suppliers of 3DS-IC materials, carriers, equipment, automation systems and devices.

Task Force Meetings

3DS-IC Task Forces will meet Wednesday, July 12.

Wednesday, July 12

  • 3DS-IC Bonded Wafer Stacks TF
  • 3DS-IC Inspection & Metrology TF
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