TechTALK: Integration Technologies - Enabling the Systems of the Future

TechTALKS Stage North Wednesday, July 10
2:00pm to 4:30pm

Our morning session focused on applications driving packaging and integration. In our afternoon session, we will take a closer look at the design and manufacturing technologies that enable that integration.

Recent advancements in Fan Out/Fan In, Wafer-Level, Panel-Level, Embedded Substrates and other technologies have provided cost-effective system integration solutions that are enabling the latest application advancements. Speakers in this session will go into detail on design, material and process capabilities as enabling technologies.

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