The microelectronics industry continues to leverage the big data revolution and tap into Smart Manufacturing (SM) and Industry 4.0 strategies. These promise to improve integration and analytical capabilities and enable solutions such as predictive maintenance and optimized scheduling and dispatch. Among the many tenets of Smart Manufacturing, “digital twin” (DT) solutions represent a significant opportunity for microelectronics manufacturers to leverage existing and emerging technologies to improve quality and throughput and reduce variability and cost. According to Wikipedia “A digital twin refers to a digital replica of physical assets, processes and systems that can be used for various purposes”. If we look at DT in the microelectronics space we realize that our industry is already successfully employing DT components fab-wide. In this presentation we will explore the current state-of-the-art of DT technologies and solutions in our industry, identify areas where the industry is beginning to explore and benefit from abstracting and combining these DT capabilities, an outline an industry vision and roadmap for DT that will provide for significant improvements in quality, throughput and reduction in variability and cost over the next 10 years.