The Global MEMS/NEMS Technical Committee is currently working on topics including Wafer Bonding Alignment Targets; Step-Height Measurements of Thin, Reflecting Films using an Optical Interferometer; and Ultra High Purity Microscale Fluidic Systems for Use in Scalable Process Environments.
Task Force Meetings
MEMS/NEMS Task Forces will meet Thursday, July 13.
Thursday, July 13
- MEMS Microfluidics TF
- Joint MEMS & Sensors Industry Group (MSIG), MEMS Substrate, MEMS Material Characterization TFs