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MEMS/NEMS Meeting (Joint MEMS & Sensors Industry Group (MSIG), MEMS Substrate, and MEMS Material Characterization Task Forces)

San Francisco Marriott Marquis Thursday, July 12
1:00pm to 3:30pm

The Global MEMS/NEMS Technical Committee explores the need for Standards for MEMS and NEMS devices that cannot be handles by existing technical committees. Current topics include Wafer Bonding Alignment Targets; Step-Height Measurements of Thin, Reflecting Films using an Optical Interferometer; and Ultra High Purity Microscale Fluidic Systems for Use in Scalable Process Environments.

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