Co-hosted by the Electronic Packaging Society (EPS) of IEEE and the SEMI Americas Advanced Packaging Committee
The proliferation of consumer devices, the huge increase in data services, and the growing storage demands for a variety of data types have already lead to a growth in data centers. The next wave of demand will focus on driving even higher performance out of systems that input, compute, and store data. Further technical complexity will stem from the need to integrate newer optical and AI systems.
This session will focus on the increasing heterogeneity of these high performance computing systems, as well as new demands on the integration technologies needed. We will also look into some of the manufacturing technologies enabling the next generation of high performance computing.