Hosted by the Semiconductor Components, Instruments & Subsystems (SCIS) Special Interest Group
As the industry prepares for sub-10nm, HVM (high-volume manufacturing), there is increasing acknowledgement that the defects introduced by process-critical OEM components are affecting final wafer quality, resulting in lower yields and higher manufacturing costs. It’s a major concern that is impacting the entire semiconductor manufacturing supply chain. As such, it is with great urgency that pre-competitive collaboration among key industry stakeholders needs to take place — and it needs to happen now. This session will explore perspectives from both suppliers and end-users on the critical role that components play in future semiconductor industry roadmaps. Speakers will offer insight on supply chain challenges, from a technology standpoint, as well as their vision on what needs to occur to enable HVM at advanced process nodes.