The electronics industry has maintained the rate of progress predicted by Moore’s Law since the observation was published in 1965. The primary driver was scaling of CMOS. It was the “low hanging fruit” providing the lowest cost to maintain progress. The benefits of scaling no longer support that rate of progress and new technology is needed. Heterogeneous Integration is the technology that fills that need and it will be a major contributor to progress for the next 3 decades or more. The key elements of this technology include 3D system integration, heterogeneous integration by material and component type, system integration in the package and interconnecting packages by photonics supporting more complex systems. The elements needed that will be discussed include:
- New materials
- New device types
- New production processes
- New system and network architectures
These elements enable improvement in cost, power, latency and performance. The Heterogeneous Integration Roadmap (HIR) is designed to identify difficult challenges anticipated before they become roadblocks. The objective is to enable precompetitive collaboration among academia, industry, and government to accelerate the pace of progress while enabling continued cost reduction.