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SiP, and Advanced Packaging Solutions for Emerging Applications

Thursday, July 13 2:30pm

The world around us is changing, as sophisticated technologies enable an era of smart electronics, all geared towards improving global lifestyle and efficiency at unprecedented scale.  Device and systems packaging are at the forefront, and evolving to surpass any challenges posed by this electronics transformation. As a community, we are increasingly innovating across technology and ecosystem to facilitate the timely manufacture of devices enabling higher performance, lower power, greater speed, and increased bandwidth. SiP is a powerful technology, facilitating the successful integration of multiple and diverse devices within a single package. Yin Chang will explore SiP and its intricacies, and discuss why it is emerging as a highly compelling packaging technology, as the evolution of our smart planet continues.

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