Advanced packaging plays an ever more important part in integrating diverse chips into smaller packages, with a plethora of diverse emerging technology options for stacking, embedding, fanning in and fanning out. What’s new, what’s next, and what do we still have to solve?
Advanced Packaging, Meet the Experts: Day 2
SMART Journey, Meet the Expert Theater, Moscone West Thursday, July 13 1:30pm to 3:00pm
Do you want to attend this session? Register for SEMICON West.
William Chen, PhD
Heterogenous Integration Roadmap, IEEE Electronic Packaging Society
EVP and General Manager