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Challenges and Opportunities in the OSAT Market

Tuesday, July 11 3:00pm

The semiconductor industry packaging and assembly business is undergoing many changes.

  • Wire bond still accounts for the bulk of the industry, but strong growth is seen in advanced packaging, defined as flip chip and wafer level packaging (WLP). 
  • With the move to increased packaging and assembly at the wafer level, OSATs face competition from foundries.
  • With the development of China’s domestic semiconductor industry, much of the growth in OSAT revenues expected in China.

This presentation examines these trends and discusses the changing OSAT market.  SEMI’s new Worldwide OSAT Manufacturing Sites Database is unveiled for the first time.

 

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