Hosted by the SEMI Americas Advanced Packaging Committee
Following up on our previous session, we will dig into the key packaging technologies enabling the advanced electronic systems that we have seen come to the market recently. Wafer-level packaging (WLP), 2.5D (interposer), embedded substrates, and, perhaps most comprehensively, SiP (System-in-Package) have been true inflections in enabling many of these new systems. We will also delve into the challenges in current technologies and opportunities for extending and improving them.
- William Chen, Ph.D. Senior Technical Advisor, ASE Group
- Annette Teng, Ph.D., CTO, Promex Industries