There is a great urgency in preparing the supply chain to enable HVM at 7nm and beyond. To date, there has been no industry alignment on how defects are measured on various components and subcomponents or on how these results are reported. This is especially alarming when several yield excursions have been linked to a wide range of component- and subcomponent-induced defectivity. Furthermore, current component and subcomponent defect traceability lacks the rigor for advanced technologies, particularly with regard to detectability, sensitivity, and methodology. Finally, while some standards exist, they are often inadequate for addressing advanced process control requirements. In order for the industry to determine what the particle and defectivity limits will be at advanced nodes, there first needs to be an understanding of current contributions of various process-critical components.
In this session, efforts on baseline measurements for critical components, developed under the SEMI Semiconductor Components, Instruments & Subsystems (SCIS) Special Interest Group will be presented. The session will also provide case studies on how these methods influence component selection, utlimately reducing defectivity during manufacturing.