Integrating Conventional Silicon in Flexible Electronics

Thursday, July 11
10:30am–1:30pm
South Hall, Moscone Center

 

 

            Session Partner:  

 
     

Description

Printed electronics have made great progress in materials and processing technologies for flexible, conformable and robust applications such as wearable biomedical sensors and imagers, displays, consumer packaging, and toxic and structural sensors. Some of the flexible electronics systems incorporate both printed electronics and silicon technology.  Various techniques are available for creating very thin silicon chips that can be incorporated in flexible systems. Finding ways to cost effectively and reliably integrate more conventional processors or MEMS sensors or high speed RF communications with printed/flexible electronics systems may open the way to wider applications. Where do printed/flexible electronics systems offer the best solutions? Where could integrating traditional silicon make most sense for cost or performance? What are the remaining challenges and promising solutions for process integration, handling, packaging, integrating and testing hybrid silicon/flexible approaches?

  

 

   
Investigation of Components Attachment onto Low Temperature
Flex Circuit
Quyen Chu
Advanced Technology Manager
Jabil
 
Introduction to Thinfilm Technology
Chandrasekhar Durisety
Assistant Director
Thin Film Electronics
 
Flexible Silicon-based Micromodules for the Internet of Things
Jayna Sheats
Chief Technical Officer
Terepac Corporation
 
Techniques for Die Extraction and Thinning of COTS Electronic in the
Prototyping of Flex Systems
Dahwey Chu
Principal Member of Technical Staff, Microsystems Integration Department
Sandia National Laboratories
 
FleX™ Silicon-on-Polymer™: Flexible Electronics from Conventional
Silicon ICs
Douglas R. Hackler
President and CEO

American Semiconductor

 


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