David McCann has been at GLOBALFOUNDRIES for six years, where he is Vice President of Packaging R+D and Operations. He is responsible for GF’s internal bump and probe factories, for packaging and test development for GF’s Foundry, ASIC, and RF businesses, for OSAT partnerships, supply chain qualification and external bump-probe-assembly-test production. He is based at the Fab 8 site, in Malta, New York. He led the GLOBALFOUNDRIES/IBM post-fab process and business integration.
David’s background prior to GLOBALFOUNDRIES was in flip chip technology development and business management in the OSAT industry, and prior to that, flip chip assembly and product development in implantable medical electronics.
David was a member of the ECTC Executive Committee for 10 years, and is presently on the IEEE CPMT BoD and ECTC Steering Committee.