Heterogeneous Integration with MEMs and Sensors

Heterogeneous Integration with MEMS and Sensors

Tuesday, July 12

2:00pm-4:30pm

NorthOne TechXPOT

Hosted by the SEMI Advanced Packaging Committee - Americas


Session Chair	Prof. Dr. Klaus-Dieter Lang, Head of Fraunhofer IZM

Description	With double-digit growth forecasted for the MEMS industry, more MEMS devices and sensors are finding applications into the global market place. Smart phones, handheld gaming devices and consoles, and automotive applications are leading the charge. With devices on the market ranging from pressure sensors, RF-MEMS, accelerometers, and gyroscopes; to microphones, microactuators, compasses, CMOS image sensors, chemical sensors, microfluidics, mirrors, and displays, there’s no doubt that MEMS are growing fast. To paraphrase the ITRS, the intersection of market and technology is calling for “More MEMS and More Than MEMS”. This session will feature speakers from all parts of the ecosystem to address how future visions will be realized through the heterogeneous integration of MEMS and ICs.
Agenda

Welcome Remarks and Introduction Prof. Dr. Klaus-Dieter Lang, Head of Fraunhofer IZM

		Co-moderators: Asif Chowdhury. Analog Devices Michael Gaitan. NIST

2:00pm-2:30pm		Keynote "One Size Doesn't Fit All" Presentation in PDF Rob O'Reilly (Biography) Senior Technical Staff MEMS Sensors and Technology Group Analog Devices Inc.

2:30pm-3:00pm		"MEMS and Sensor Packaging and Assembly: Challenges for Heterogeneous Integration" Presentation in PDF Jan Vardaman - Biography President TechSearch International

		Panelists
3:00pm-3:10pm		"3D Wafer Level Heterogeneous Integration" Presentation in PDF M. Juergen Wolf (Biography) Head of Division HDIWLP/ASSID Fraunhofer IZM

3:10pm-3:20pm		"CMOS/MEMS Heterogeneous Integration and its Packaging Technology" Presentation in PDF Yoshiaki Sugizaki (Biography) Senior Manager Advanced BEOL Technology Department Device Process Development Center Toshiba Corporation

3:20pm-3:30pm		"Heterogeneous Integration, Confluence of Tool Boxes" Presentation in PDF Gilles Poupon (Biography) Program Manager Advanced Packaging CEA-Leti

3:30pm-3:40pm		"Trends in Automotive Sensor Packaging" Presentation in PDF Dr. Horst Theuss (Biography) Principal Engineer Sensors, MEMS and Discretes Infineon Technologies

3:40pm-3:50pm		"Developing the Mid-End Foundry" Presentation in PDF Tomas Bauer (Biography) VP Marketing & Sales Silex Microsystems

3:50pm-4:30pm		Panel Discussion

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