Hem Takiar is the vice president of packaging and assembly engineering for Western Digital. With more than 35 years of experience in semiconductor assembly and device packaging, he manages development teams worldwide, covering semiconductor and electronics products for consumer, OEM and enterprise sectors. Takiar was also instrumental in developing greenfield assembly/test operations in Shanghai as well as overseeing assessments of factory options in other parts of the world. Previously, Takiar oversaw the establishment of the corporate Quality and Reliability function at Western Digital globally. He holds a master’s degree in materials science from University of Illinois, Urbana Champaign.