Dr. Li LI is a Distinguished Engineer at Cisco Systems, Inc. where he leads an initiative on 3D IC integration and advanced packaging development. He has been with Cisco since 2004 and has over 20 years industry experience in IC packaging design, technology development and qualification.
Dr. Li has published several book chapters and over 50 technical papers in the field of microelectronics packaging. He is on the Board of Governors of IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society and the Board of Directors of HDP User Group International (HDPUG), Inc.
He received his M.S. and Ph.D. degrees in Mechanical Science and Engineering from the University of Illinois at Urbana-Champaign.