SESSIONS/EVENTS

pkg bnr - 12

Tuesday, July 9, 2013
10:30am-12:30pm	Generation Mobile: Enabled by IC Packaging Technologies Hosted by the Advanced Packaging Committee, SEMI Americas TechXPOT North, North Hall

1:30pm-4:45pm	IEEE/CPMT Workshop on: “THIN IS IN”: Thin Chip & Packaging Technologies as Enablers for Innovations in the Mobility Era San Francisco Marriott Marquis

Wednesday, July 10, 2013
1:00pm-3:30pm	Advancing 2.5D and 3D Packaging through Value Engineering Hosted by the Advanced Packaging Committee, SEMI Americas TechXPOT North, North Hall

Thursday, July 11, 2013
10:30am-12:30pm	MEMS & Sensor Packaging for the Internet of Things Hosted by the Advanced Packaging Committee, SEMI Americas TechXPOT North, North Hall

1:00pm-3:30pm	ITRS Back End of Line Technologies (Partner Event) TechXPOT North, North Hall

Interested in a sponsorship opportunity? Contact Marlene Sibley at msibley@semi.org or +1.408.943.6988 today!

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