SEGMENTS
| SEMICON West 2013 Wafer Processing Sessions and Events | |
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Critical technology issues on display and in discussion include—New Device Architectures: FinFETs/veritical/multi-gate transistors, high-k metal gates; Advanced Lithography: Immersion, double-patterning, EUV, e-beam, imprint, source/mask optimization-SMO; EUV Technologies: Laser produced plasma (LPP), discharge produced plasma (DPP); Atomic Layer Deposition (ALD); GaN and other III-V/Compound Semiconductors; Nano Defect Detection and Metrology; Advanced Components and Subsystems. |
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