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Advanced packaging is in the early stages of a dynamic growth phase. Demand for equipment and related tools in the 3DIC and wafer-level packaging area is forecasted to grow from approximately $370 million in 2010 to over $2.5 billion by 2016.  SEMICON West exhibitors and programs will feature the latest innovations and developments in advanced packaging, packaging materials, and related technologies.





Exhibiting Opportunities Available for Packaging

Companies with innovative technologies and solutions for advanced packaging are invited to exhibit at SEMICON West. Great opportunities are still available – learn moreabout exhibiting at SEMICON West!


Programs and Events on Packaging

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