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SEGMENTS
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Advanced packaging is in the early stages of a dynamic growth phase. Demand for equipment and related tools in the 3DIC and wafer-level packaging area is forecasted to grow from approximately $370 million in 2010 to over $2.5 billion by 2016. SEMICON West exhibitors and programs will feature the latest innovations and developments in advanced packaging, packaging materials, and related technologies.
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Don't miss new packaging opportunities at Extreme Electronics
SEMICON West features more for the packaging community than just semiconductors. The Extreme Electronics TechZONE is focused on new markets and emerging technologies and features technical sessions, presentations, and exhibits focused on MEMS, high-brightness LEDs, plastic electronics, and other new and disruptive technology markets. Sessions at the Extreme Electronics TechXPOT stage will highlight the unique packaging challenges and opportunities for these technologies.
Exhibiting Opportunities Available for Packaging
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Companies with innovative technologies and solutions for advanced packaging are invited to exhibit at SEMICON West. Great opportunities are still available – learn moreabout exhibiting at SEMICON West! |
