LEDs/Solid State Lighting

The global LED market is growing fast as consumers demand and electronics manufacturers look to create more advanced and energy-efficient products.

Forecasts project the global LED market will grow to around US$14 billion in 2013 as countries around the world, including China, Japan, and the United States, invest in energy-efficient lighting technologies. Increasingly used in lighting applications for flat panel display (FPD) televisions and as a replacement for incandescent and fluorescent lighting, LEDs promise to significantly reduce energy consumption and contribute to efforts combating global climate change.

The latest technologies and trends for LED manufacturing is a major focus area of Extreme Electronics, the "show-within-the-show" at SEMICON West focusing on technologies and opportunities beyond semiconductors. LED exhibitors and presentations at Extreme Electronics will highlight the latest market trends and solutions for increasing manufacturing productivity and reducing costs.

LED/Solid State Lighting Technical Sessions

10:30am–12:50pm

More Lumens per Dollar: The Road to More Efficient HB LED Manufacturing– Progress and next challenges in front-end manufacturing

2:00pm–4:30pm

More Lumens per Dollar: The Road to More Efficient HB LED Manufacturing– Progress and next challenges in back-end manufacturing

Other LED related Events at SEMICON West

2:00pm–2:20pm

MOCVD Market Status and Outlook
Ross Young, Sr. Vice President, IMS Research
SEMI Theater located in the SEMI Booth, North Hall Lobby, Moscone Center

3:00pm–3:20pm

High Brightness LEDs: Assembly & Materials Challenges/Opportunities
Jan Vardaman, President, TechSearch
SEMI Theater located in the SEMI Booth, North Hall Lobby, Moscone Center

12:30pm–12:50pm

Companies Roar Again– Fab Spending more than Doubles in 2010
Spending for memories surges again, while LED fabs brighten the future. . .
Christian Gregor Dieseldorff, Sr. Analyst, SEMI Industry Research and Statistics
SEMI Theater located in the SEMI Booth, North Hall Lobby, Moscone Center

Where can Sector Agreement on Basics Outside Company IP simplify Production and Help improve yields?

8:00am–10:00am

Unique needs for HB LED substrates and traceability
Marriott, Pacific I.

10:00am–12:00pm

Requirements for wafer carriers, carrier wafers and traceability

These informal sessions aim to bring interested parties across the sector together to discuss specific substrate and carrier requirements for HB-LEDs, and where they differ from the CMOS sector, to begin to work towards some consensus that would enable equipment and material suppliers to provide the industry with more cost effective tools with better yields. The current M65 standard for sapphire substrates covers only 2" and 3" wafers for CMOS applications, while the larger HB-LED wafers present more complex tradeoffs of thickness and cost vs yield. Wafer shipping and process carriers need to be suited to wafer size and sag. And with the more costly larger wafers and die, does it begin to make sense to mark the backside in some common way, like the 300mm silicon sector all does, for traceability to improve yields? What challenges will carrier wafers, now emerging for back-end processing, face in both automation and traceability?
Marriott, Pacific I.

Exhibiting Opportunities Available for LED

Companies with innovative technologies and solutions for LED manufacturing are invited to exhibit at SEMICON West within the Extreme Electronics zone. Close proximity to the presentation stage plus focused attendee marketing ensures high visibility with visitors focused on and interested in LED technologies. Great opportunities are still available – learn more about exhibiting at SEMICON West and Extreme Electronics!

Join the Extreme LED Community

Working with our partner SemiNeedle, we are proud to present the Extreme LED Online Community. This site serves as a resource for information about LED manufacturing, and as a forum for discussions about LEDs. Come learn more about LEDs and join the community today!

semicon west2010

Segments

LEDs/Solid State Lighting

LED/Solid State Lighting Technical Sessions

Other LED related Events at SEMICON West

Exhibiting Opportunities Available for LED

Join the Extreme LED Community



10:30am–12:50pm	More Lumens per Dollar: The Road to More Efficient HB LED Manufacturing– Progress and next challenges in front-end manufacturing

2:00pm–4:30pm	More Lumens per Dollar: The Road to More Efficient HB LED Manufacturing– Progress and next challenges in back-end manufacturing


Other LED related Events at SEMICON West

2:00pm–2:20pm	MOCVD Market Status and Outlook Ross Young, Sr. Vice President, IMS Research SEMI Theater located in the SEMI Booth, North Hall Lobby, Moscone Center
3:00pm–3:20pm	High Brightness LEDs: Assembly & Materials Challenges/Opportunities Jan Vardaman, President, TechSearch SEMI Theater located in the SEMI Booth, North Hall Lobby, Moscone Center

12:30pm–12:50pm	Companies Roar Again– Fab Spending more than Doubles in 2010 Spending for memories surges again, while LED fabs brighten the future. . . Christian Gregor Dieseldorff, Sr. Analyst, SEMI Industry Research and Statistics SEMI Theater located in the SEMI Booth, North Hall Lobby, Moscone Center


Where can Sector Agreement on Basics Outside Company IP simplify Production and Help improve yields?
8:00am–10:00am	Unique needs for HB LED substrates and traceability Marriott, Pacific I.
10:00am–12:00pm	Requirements for wafer carriers, carrier wafers and traceability
	These informal sessions aim to bring interested parties across the sector together to discuss specific substrate and carrier requirements for HB-LEDs, and where they differ from the CMOS sector, to begin to work towards some consensus that would enable equipment and material suppliers to provide the industry with more cost effective tools with better yields. The current M65 standard for sapphire substrates covers only 2" and 3" wafers for CMOS applications, while the larger HB-LED wafers present more complex tradeoffs of thickness and cost vs yield. Wafer shipping and process carriers need to be suited to wafer size and sag. And with the more costly larger wafers and die, does it begin to make sense to mark the backside in some common way, like the 300mm silicon sector all does, for traceability to improve yields? What challenges will carrier wafers, now emerging for back-end processing, face in both automation and traceability? Marriott, Pacific I.