Speaking Opportunities/Call for Papers

As the premier annual event for the global semiconductor and related technology industries, SEMICON West, along with its co-located and partner events, is a respected platform for the presentation and discovery of the latest trends and ideas in semiconductor manufacturing and related microelectronics industry


Invitation for Presenters

SEMI welcomes industry input and suggestions from potential speakers. SEMICON West 2015 will feature more than 60 hours of technical sessions and presentations across the popular TechXPOT programs, the new Semiconductor Technology Symposium. TechXPOT programs in the Moscone Center North and South Halls will continue focusing on special topics in semiconductor manufacturing, and adjacent and related microelectronics technologies. The new Semiconductor Technology Symposium will offer technology trends, developments and new technology information in the areas of advanced materials and processing, lithography, metrology, 450mm, advanced packaging,  and semiconductor test.




  • Advanced lithography/Advanced films
    • Cost and productivity challenges below 14nm
    • Adjunct lithography technologies (e.g., DSA, nanoimprint)
    • Infrastructure developments to support HVM
  • Advanced materials and processes
    • Other process implications for manufacturing next-generation transistors
    • Materials research beyond silicon
    • HVM solutions taking shape below 14nm
    • Role EDA tools need to play below 14nm
  • Contamination control for advanced materials
  • New and advanced metrology solutions
  • Interconnect challenges at sub-10nm
  • Improving Yield on Non-Planar ICs
  • Failure analysis
  • Silicon Photonics
  • Semiconductor test
  • Design for test
  • Application Level Testing
  • Advanced packaging
  • Design for packaging
  • MEMS: What's next in MEMS?  Significant developments in sensing, packaging and manufacturing technologies with near-term impact
  • Packaging of MEMS and Sensors
  • Iot 1: What the IoT means for semiconductor manufacturing
  • IoT 2: How the IoT and 3D printing will impact the semiconductor manufacturing supply chain
  • Printed and flexible electronics
  • Heterogeneous Integration for SiP and Modules


  • Submit a 500 word abstract.
  • Accuracy in Title and Description: The quality of the description of your presentation matters. The ability for your description to clearly explain what the attendees will take away from your presentation is critical for your submission to make it through the review process.

Submit an Abstract

Deadline to  submit and abstract for consideration was March 20, 2015.  

Important Dates

Abstracts Due

March 20

Author Notification

May 1

Speaker Letter of Agreement Due

May 22

PowerPoint Presentation Due
Presentation time: 20 minutes

June 25

Presentation Date

Depending on the session, July 14, 15 or 16



If you have any questions, please contact Agnes Cobar at Email: or
Telephone: +1.408.943.7952.

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