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Best of West  

Solid State Technology and SEMI are pleased to present the 2013 Best of West product awards program. It is the second time that the two groups are co-hosting the awards program. The Best of West Award is given to recognize important product and technology developments in the microelectronics industries. The Best of West Award will provide maximum visibility and value to exhibitor winners, spotlighting exciting new products and technologies in front of a large global audience. All exhibitors are encouraged to participate. Winners will be selected by an independent panel of highly qualified judges. Best of West finalists and award recipients will be selected based on the submission’s financial impact on the industry, engineering or scientific achievement, or societal impact and benefits.

 

In 2013, the “Best of West” awards presented by Solid State Technology and SEMI during SEMICON West will be expanded to six categories:

 

  • Wafer Processing Equipment
  • Assembly/Packaging Solutions
  • Metrology and Test
  • Advanced Materials and Materials Management
  • Components and Subsystems
  • Facilities and Software

Qualifying Products, Services and Technologies

 

Consideration for the Best of West awards will be limited to all products, services and technologies publicly introduced from August 1, 2012 to SEMICON West 2013. Submitting companies must be developers of the product or technology (no rep firms or third parties) and must be exhibitors at SEMICON West. SEMI reserves the right to make all final decisions on eligibility. Entries are limited to two per exhibitor.

 


Share Your Winning ‘Best of West’ Products with Solid State Technology Readers!


If your products are winners or finalists for a Best of West award, Solid State Technology can help you educate our audience of semiconductor and related electronics manufacturing professionals about them.

 

Special Video Showcase Offer

Call for Entries

Submitting products, services and technologies for consideration is simple. To submit entries for consideration, complete the online form and provide the required descriptions and justifications here. In addition to company name and contact information, a maximum 750-word description of the new product /technology is required, along with a max. 300-word summary of why it’s important submitted in Microsoft Word. Supporting charts, graphs and illustrations must be submitted as part of the Microsoft Word document. Entries that are not submitted in Microsoft Word or otherwise do not follow the above instructions, will be rejected for consideration.

 

Deadline for submissions extended to May 17, 2013.


Submit a Best of West Entree

Selection of Finalists

Finalists will be selected by a distinguished panel of judges from academia and the industry.   Finalists will receive recognition for their achievement through press releases, on the SEMICON West website, through online exhibitor directories, and special booth displays.

Selection of Winners

Winners will be announced during SEMICON West and will be selected from the pool of finalists. Judges may visit exhibitors during SEMICON West to obtain further information on the submission.



Congratulations to the 2012 Best of West Winner!

 

QC-TT defect inspection system   
The QC-TT defect inspection system from Jordan Valley Semiconductor UK Ltd. solves key issues in the use of 450mm wafers in a manufacturing environment, where wafers are subjected to more handling steps and the thermal stresses on larger wafers are much higher. This makes the wafers more prone to breakage, which can be predicted using the QC-TT. The system can also identify the slip and other crystalline defects in wafers, which may not have catastrophic effects on the substrate integrity but will contribute to a reduction in yield.
 

Congratulations to the 2012 Best of West Finalists!

Nikon Logo

 

 

  NSR-S320F Dry ArF 193 nm scanner
The NSR-S320F Dry ArF 193 nm scanner from Nikon Corporation is based on the company’s Streamlign platform, to satisfy the demanding non-immersion overlay accuracy, stability, and ultra-high productivity requirements essential to cost-effective 22 nm applications and beyond. The Streamlign platform, which was first employed on immersion scanners, provides industry-leading overlay accuracy less than or equal to 3 nm with throughput greater than or equal to 200 wafers per hour (WPH).
 X-Plane Analysis
X-Plane Analysis from Nordson DAGE is an option for the company’s DAGE range of X-ray inspection systems. It uses a tomosynthesis technique to create 2-D X-ray slices in any plane of a semiconductor device or printed circuit board assembly. The user can get a very high level of detailed information about potential failures without the need to destroy the sample, usually necessary with traditional CT systems.
 


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