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Best of West  



Solid State Technology and SEMI are pleased to present the 2014 Best of West product awards program. It is the second time that the two groups are co-hosting the awards program. The Best of West Award is given to recognize important product and technology developments in the microelectronics industries. The Best of West Award will provide maximum visibility and value to exhibitor winners, spotlighting exciting new products and technologies in front of a large global audience. All exhibitors are encouraged to participate. Winners will be selected by an independent panel of highly qualified judges. Best of West finalists and award recipients will be selected based on the submission’s financial impact on the industry, engineering or scientific achievement, or societal impact and benefits.

 

For 2014, the “Best of West” awards presented by Solid State Technology and SEMI during SEMICON West expanded to six categories:

 

  • Wafer Processing Equipment
  • Assembly/Packaging Solutions
  • Metrology and Test
  • Advanced Materials and Materials Management
  • Components and Subsystems
  • Facilities and Software

Qualifying Products, Services and Technologies

 

Consideration for the Best of West awards will be limited to all products, services and technologies publicly introduced from August 1, 2013 to SEMICON West 2014. Submitting companies must be developers of the product or technology (no rep firms or third parties) and must be exhibitors at SEMICON West. SEMI reserves the right to make all final decisions on eligibility. Entries are limited to two per exhibitor.


Submit an Entry

Call for Entries

Submitting products, services and technologies for consideration is simple. To submit entries for consideration, complete the online form and provide the required descriptions and justifications here. In addition to company name and contact information, a maximum 750-word description of the new product /technology is required, along with a max. 300-word summary of why it’s important submitted in Microsoft Word. Supporting charts, graphs and illustrations must be submitted as part of the Microsoft Word document. Entries that are not submitted in Microsoft Word or otherwise do not follow the above instructions, will be rejected for consideration.

 

Deadline for submissions extended to May 19, 2014.

Selection of Finalists

Finalists will be selected by a distinguished panel of judges from academia and the industry.   Finalists will receive recognition for their achievement through press releases, on the SEMICON West website, through online exhibitor directories, and special booth displays.

Selection of Winners

Winners will be announced during SEMICON West and will be selected from the pool of finalists. Judges may visit exhibitors during SEMICON West to obtain further information on the submission.


 

Best of West 2014 Winner will be announced on Wednesday, July 9, 2014

Congratulations to the 2013 Best of West Wiiner

 

 

   
Tessent® TestKompress with Cell-Aware ATPG
Significantly improves on the standard process for testing digital integrated circuits ; reduces failure escape rate by detecting defects at the transistor level that are missed by traditional automatic test pattern generation (ATPG) techniques.
 

2013 Best of West Finalists


Scorpion
Jetting and dispensing system satisfies the demanding requirements of accuracy, stability and ultra‐high productivity for modern advanced packaging solutions; slew rate of piezo jet adjusts to handle wide range of viscous materials, providing stable droplet volumes; minimal setup time.
 
                                       
      
Tessent® TestKompress with Cell-Aware ATPG
Significantly improves on the standard process for testing digital integrated circuits ; reduces failure escape rate by detecting defects at the transistor level that are missed by traditional automatic test pattern generation (ATPG) techniques.
 

ReViaTM

Endpoint detection technique for monitoring the progress of “via reveal” etch processes even at remarkably low (<0.01%) via densities; significantly increases yields for device manufacturers involved in emerging 3D packaging applications using TSVs.

 

M200 Portable Calibration Unit
Extends servicing capabilities to equipment owners, providing added convenience, reduced costs, and improved efficiencies that can cut servicing timelines from days to minutes
   
Superfast 3G
Using CGS technology, the Superfast 3G images the entire wafer at once to generate highly detailed wafer maps (800,000 points per map at 75wph). Superfast 3G measures wafer distortion used to compute device structure stresses and in-plane wafer surface displacements. South
   
Closed Loop Control System with Smart Control Interface (SCI)
Provides complete control of high purity chemical processes and delivery systems with customizable feedback capability to maintain optimum system performance; designed to support process tools that require a set flow or pressure at the point of use. 
 

Share Your Winning ‘Best of West’ Products with Solid State Technology Readers!


If your products are winners or finalists for a Best of West award, Solid State Technology can help you educate our audience of semiconductor and related electronics manufacturing professionals about them.

 

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