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News/Press Releases

Here you'll find the latest news and information about SEMICON West, including press releases, original articles, and links to industry blogs and related content sites.

Be sure to check back often as we build up to the show!

 

SEMICON West 2013 Coverage

Critical Updates from Industry Leaders on EUV, 3D Transistors and 450mm Manufacturing Targeted for SEMICON West 2013 (Press Release; Apr 23, 2013)

Semiconductor R&D: A State of Transition (Solid State Technology; April 11, 2013)

Confronting Sub-20nm Front-end Challenges "Duck and Weave" (Solid State Technology; April 15, 2013)

"Big Data Comes to Semiconductor Test (Evaluation Engineering, April 24, 2013)

SEMICON West 2013 Spotlights Industry R&D Challenges and Opportunities (Press Release; March 18, 2013)

SEMI Announces Silicon Innovation Forum to Bridge Funding Gaps for Early-Stage Companies (Press Release; Feb. 14, 2013)

SEMI Announces "Call for Presenters" for SEMICON West 2013 (Press Release; Dec. 6, 2012)

 

 

 

Post-Show SEMICON West 2012 Coverage

 

Slideshow: Scenes from SEMICON West 2012 (EE Times, July 16)

Is the Cost Reduction Associated with IC Scaling Over? (EE Times, July 16)

Chip Tool Makers Wary of Wafer Shift (Wall Street Journal, July 12)

SEMICON West Takeaways: Seasonality over Cyclicality, Lithography and Test Trends (Solid State Technology, July 16)

Semicon West 2012 Opens with Semiconductor Revenue Forecasts, High-level Perspectives (Solid State Technology, July 10)

Terry Brewer Chats about SEMI and Semiconductors at SEMICON West (VIDEO) (Solid State Technology, July 13)

The Week in Review: July 13 (Semiconductor Manufacturing & Design, July 13)

Fabless Keynote: Xilinx on Programmability @ SEMICON West (Solid State Technology, July 12)

Interviews with CEA-Leti Researchers at SEMICON West (VIDEO) (Solid State Technology, July 12)

SEMICON West Day 2: Lithography and CMP meetings (Solid State Technology, July 12)

2012 ITRS stabilized for front-end, but changes loom for 2013 (Solid State Technology, Pete Singer, July 12)

Intel Keynoter: Power Consumption Hurdles Litter Path to Exascale Computing (EE Times, July 11)

Xilinx CTO: Focus on what matters to customers (EE Times, Dylan McGrath, July 12)

Chat with Intel’s Shekhar Borkar @ SEMICON West 2012: Overpowering power consumption (Solid State Technology, July 11)

LED Insights from SEMICON West 2012 (Solid State Technology, July 11)

SEMICON West Day 1: FDSOI and TSV R&D with CEA-Leti (Solid State Technology, July 11)

SEMICON West Day 1: focus on EUV lithography and 450mm (Solid State Technology, July 11)

Solid State Technology and SEMI Announce 2012 “Best of West” Award Winner (ECN Magazine, July 11)

First 450-mm fabs to ramp in 2017, says analyst (EE Times, July 10)  

Imec at SEMICON West: interview with Luc Van den hove (Solid State Technology, July 10)

SEMI Board of Directors Election Brings New and Familiar faces (Solid State Technology, July 9)

 

More:


Semiconductor Test Terminology Guide Aims to Clarify Docking and Handling Ops (Solid State Technology, July 17)

Notes from SEMICON West: Detecting solder joint fractures (Solid State Technology, July 16)

LED fab equipment capex to brighten in H2 2012 (Solid State Technology, July 13)

2012 ITRS update: Back-end packaging and MEMS (Solid State Technology, July 13)

Roadmapping More than Moore: When the application matters (Solid State Technology, July 13)

What does healthcare have to do with semiconductors? (Solid State Technology, July 13)

SEMI Announces Mid-Year Consensus Forecast for Chip Equipment Industry (EMS Now, July 12)

Microelectronics Standards Leaders honored by SEMI (Solid State Technology, July 12)

Q3 semiconductor tool capex pull-back: Seasonal, expect Q4 uptick (Solid State Technology, July 12)

Semiconductor fab tool capex trends gleaned @ SEMICON West (Solid State Technology, July 12)

SEMICON West Day 2: Lithography and CMP meetings (Solid State Technology, July 12)

3D Integration Means even Tighter Supply Chains (Semicon Daily, July 11)

A Technology Play for 3D Packaging; Decision Time for 3D Test (Semicon Daily, July 11)

A Giant Leap? An Evolutionary Path? How All Roads Lead to 3D  (Semicon Daily, July 11)

Forging Ahead with 450mm Manufacturing (Semicon Daily, July 11)

The Energy behind Energy at SEMICON West  (Solid State Technology, July 11)

SEMICON West Day 1: FDSOI and TSV R&D with CEA-Leti (Solid State Technology, July 11)

Ecosystem emerges around new mobile chip tech (EE Times, July 11)

Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013 (Solid State Technology, July 10)

MOCVD: Is it the gateway to new Channel Materials? (Semicon Daily, July 10)

Transistors Below 22NM: A tale of two camps (Semicon Daily, July 10)

New Equipment Paradigm Needed for Packaging Innovation (Semicon Daily, July 10)

Contemporary semiconductor packaging experts open up on cost (Solid State Technology, July 10)

SEMICON West buzz: Curtains up for 450mm wafers (Solid State Technology, July 10)

ASML funding plan targets proposed 2018 EUV machine (EE Times, July 10) 

ASML in talks with Samsung, TSMC on equity stakes (EE Times, July 10) 

SEMI/Gartner Market Symposium (Semicon Daily, July 9)

Intel to Take Stake ASML (Semiconductor Manufacturing & Design, July 9)

The Elephant Has Left the Room -- 450 mm is a Go! (Solid State Technology, Dick James, July 9)

 

SEMICON West 2012 Daily News e-Newsletter

Issue 1 - June 14, 2012: Beyond 193i and Sub-22nm

Issue 2 - June 21, 2012: OLED displays and lighting, Beyond 193i Part 2

Issue 3 - June 28, 2012: Scaling beyond 22nm; metal oxide TFT development

SEMICON West 2012 News/Press Releases:

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