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2017 Programs Catalog

2017 Programs Catalog

Connect to Applications, 5G Moscone North, TechXPOT North Thursday, July 13
10:30am to 12:35pm

As data volumes double every 12 months, the pace of change is accelerating for the cloud and network technologies needed to keep up. Next generation 5G communication networks will need new semiconductor solutions for higher bandwidth transmission across denser networks, from more complex RF frontends to mm-wave transmission. Cloud providers meanwhile need a fast ramp in processing power and network speeds, with disruptive approaches for custom processors, accelerators, silicon photonics, and new memory technologies.  We’ve invited leading technologists from across these sectors to discuss the coming challenges and opportunities

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Connect to Technology, Advanced Packaging Moscone West, TechXPOT West Wednesday, July 12
2:00pm to 5:00pm

Hosted by the SEMI Americas Advanced Packaging Committee

Following up on our previous session, we will dig into the key packaging technologies enabling the advanced electronic systems that we have seen come to the market recently. Wafer-level packaging (WLP), 2.5D (interposer), embedded substrates, and, perhaps most comprehensively, SiP (System-in-Package) have been true inflections in enabling many of these new systems. We will also delve into the challenges in current technologies and opportunities for extending and improving them.

Session Chairs: 

  • William Chen, Ph.D. Senior Technical Advisor, ASE Group 
  • Annette Teng, Ph.D., CTO, Promex Industries
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Connect to Technology, Advanced Packaging, SMART Journey, Meet the Expert Theater SMART Journey, Meet the Expert Theater, Moscone West Tuesday, July 11
3:00pm to 4:30pm

Advanced packaging plays an ever more important part in integrating diverse chips into smaller packages, with a plethora of diverse emerging technology options for stacking, embedding, fanning in and fanning out. What’s new, what’s next, and what do we still have to solve? 

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Connect to Technology, Advanced Packaging, SMART Journey, Meet the Expert Theater SMART Journey, Meet the Expert Theater, Moscone West Thursday, July 13
1:30pm to 3:00pm

Advanced packaging plays an ever more important part in integrating diverse chips into smaller packages, with a plethora of diverse emerging technology options for stacking, embedding, fanning in and fanning out. What’s new, what’s next, and what do we still have to solve? 

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Connect to Technology, Advanced Packaging Moscone West, TechXPOT West Wednesday, July 12
10:30am to 12:30pm

Co-hosted by the CPMT Society of IEEE & the SEMI Americas Advanced Packaging Committee

Over the last few years, system and package engineers have been using the power of new packaging and assembly technologies to build in high performance and optimized form-factors for a slew of new products - from high-performance IoT and wearables, to blazing game processors, AI & VR products, autonomous vehicles, new function-oriented data-centers and networks. This session will explore the technology innovations that enable some of the leading applications, including SiP, embedding, integrated photonics, 2.5D & 3D packaging.  We will also take an in-depth look at what are the upcoming challenges in heterogeneous integration and how closer collaboration and co-design can benefit the whole value chain.

The afternoon seesion: Advanced Packaging Technologies Enabling Advanced Applications follows at 2:00pm

Session Chairs:

  • Li Li, Ph.D, Distinguished Engineer, Cisco Systems
  • Hem Takiar, Vice President Packaging/Assembly Engineering Western Digital Corporation
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Industry Outlook Yerba Buena Theater Tuesday, July 11
2:00pm to 5:00pm

While the global semiconductor industry continues its consolidation through large-scale mergers and acquisitions, China’s semiconductor industry is embarking on a new round of expansion with heavy investment from public and private funding. At this forum, IC and investment community executives will share their views on the industry’s evolution and offer insights on investment, M&A, and innovation trends in China. With informative presentations and multiple networking opportunities, the China Strategic Innovation & Investment Forum is the place where markets, technology, talent, and funding meet.

Co-Organizers: CASPA and TechCode

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Extend Your SEMICON West Experience

You didn’t have to be at every session at SEMICON West to get in the know. Remember, you can download all the presentations—even those you didn’t attend—on our Mobile App. It’s like having three-days of illuminating sessions in the palm of your hand.

Download Presentations

Most session slides are available for downloading to SEMI members, Thought Leadership and All-In Pass holders. Contact us if you don’t have the required password.

Move Presentations Off the Mobile App

Select the Gear icon on the dashboard and then “Email My Show Summary” to send available presentations to your desktop or share them with your colleagues.

Connect with Exhibitors

If you want to connect with specific SEMICON West exhibitors but didn't have the time during the show, just select the Exhibitors icon to find who you're looking for. Most eBooths have contact information. 

Connect with Attendees

Select the Attendees icon to find who you want to connect with and tap "Request Friend" to start a conversation

 

Don’t delay, the presentations go off line in 30 days.* The SEMICON West mobile app is available from Google Play or the App Store.

If you need the password in the Mobile App to download the files, please contact our Customer Care Team. 

 

 

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Connect to Applications, IoT, SMART Journey, Meet the Expert Theater, MEMS & Sensors SMART Journey, Meet the Expert Theater, Moscone West Wednesday, July 12
10:30am to 12:30pm

The vast potential of the Internet of Thing still depends on some major further improvements in a host of core technologies to make systems from cities to factories, homes to health monitoring, smarter, lower power, and better connected. Experts discuss what IoT really means to the IC industry, and the technology challenges and opportunities across these emerging areas.  

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Mary G. Puma
President and Chief Executive Officer
Axcelis
Shaheen Dayal
Vice President, Technology & Manufacturing Group Director, Fab Technology Sourcing
Intel
Lori Ciano
Vice President of Supply Chain
Brooks Automation
Regenia Sanders
Principal, Advisory Services
Ernst & Young
Keynotes & Executive Panels Yerba Buena Theater Wednesday, July 12
2:00pm to 3:00pm
Due to recent advances in semiconductor technology, the world is on the verge of creating communication methods with unprecedented information exchange capabilities. The Big Data Revolution, or so-called 4th Industrial Revolution, fuses the physical and digital worlds, and has the potential to connect billions of people and dramatically enhance the productivity and effectiveness of organizations. Turning that promise into reality depends on collaboration and continued advances throughout the semiconductor supply chain. The panel, comprised of business executives working across this supply chain, will explore the opportunities and business challenges that this poses.  
 
• How is Big Data affecting industry from a growth and strategy perspective?
• How and where can predictive analytics have the biggest impact? 
• What effect does this have on collaboration across the supply chain?
• What can we learn from other industries to enhance our existing processes?
• What do these changes mean for device makers, equipment manufacturers and materials suppliers?

 

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It was a SEMICON West like never before. You couldn’t be everywhere at once, so check out our highlight reel to see the greatest hits, some of which you might have missed. Keynotes, breaking news, and breakthroughs from the TechXPOTs—it’s all here and much more. > View SEMICONWest 2017 Highlights 

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Connect to Applications, SMART MedTech Moscone North, TechXPOT North Thursday, July 13
2:00pm to 4:00pm

Presented by FlexTech

Advances in electronics and medical understanding are converging to create an innovation revolution in digital medicine and monitoring (Smart MedTech). New digital solutions are reshaping patient treatment and monitoring and providing new levels of care for a broad range of human applications, from treating world-class athletes and first responders to the chronically ill and elderly. New innovations include smart patches for human-performance monitoring, flexible x-ray sensors, remote monitoring of medications, and novel medical diagnostics. Join us at the Smart MedTech session to hear subject matter experts describe how advanced electronics are reshaping the medical and healthcare industries.

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Standards San Francisco Marriott Marquis Tuesday, July 11
9:00am to 12:00pm

The Global Facilities Technical Committee identifies the technical needs of the industry for facilities services, equipment and equipment installation. Facilities services typically include equipment installation, power, water, exhaust and support systems. This committee meets jointly with the Global Gases Technical Committee.

Task Force Meetings

Facilities Task Forces will meet Monday, July 10.

Monday, July 10

  • Building Information Modeling (BIM) TF
  • F51 (Perfluoroelastomer) Revision TF
  • Power Grid Harmonics TF
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Standards San Francisco Marriott Marquis Tuesday, July 11
9:00am to 12:00pm

The Global Gases Technical Committee identifies the technical needs of the industry for bulk gases, specialty gases, components and gas distribution systems. This committee meets jointly with the Global Facilities Technical Committee.

Task Force Meetings

Gases Task Forces will meet Monday, July 10.

Monday, July 10

  • Filters & Purifiers TF
  • Gases Specification TF
  • Heater Jacket TF
  • Mass Flow Controller TF
  • Materials of Construction of Gas Delivery Systems TF
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Industry Outlook Yerba Buena Theater Thursday, July 13
8:30am to 12:30pm

Location: Yerba Buena Theater

Co-sponsored by SEMI and Gartner, this year’s symposium provides a midyear market update as well as a forum to discuss pertinent business issues. Together, SEMI and Gartner will present market forecasts and analyses of the semiconductor, capital equipment, materials, and adjacent industry sectors. New this year: The symposium will conclude with a moderated panel, where Wall Street analysts will provide an interactive discussion of the microelectronics industry, with perspectives from Bulls & Bears. Join us to learn about the trends, opportunities, and issues impacting SEMI members, their customers, and the industry as a whole. We will cover the CAPX spend outlook, the impact of continuing consolidation, increased manufacturing costs due to technology delays, new end-markets, and more.

Who should attend:

  • Chief Executive Officers/Presidents
  • Chief Financial Officers
  • Business Development Managers
  • Analysts
  • Senior Sales & Marketing Professionals
  • Procurement
  • Business Development
  • Consulting & Product Planning
  • Finance
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Standards San Francisco Marriott Marquis Thursday, July 13
10:30am to 12:00pm

The Global HB-LED Technical Committee promotes mutual understanding and improved communication between users and suppliers of HB-LED (high-brightness light-emitting diode) materials, carriers, automation systems and devices.

Task Force Meetings

HB-LED Task Forces will meet Thursday, July 13.

Thursday, July 13

  • HB-LED Joint Wafer/Source Materials/PSS TFs
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Rob Oshana
Senior Director, Software R&D, Microcontrollers
Freescale
Training & Development San Francisco Marriott Marquis Wednesday, July 12
1:00pm to 5:00pm

Intermediate Level – Embedded Systems/IoT Development Includes Live Demonstrations

While this course naturally follows the introduction to Embedded Systems/IoT Development, if you have experience in embedded systems development, the introduction course is not a requirement.

This Intermediate course covers the key methods and technologies for each phase of the embedded systems development process: specification, partition, design, integration, validation, maintenance and upgrade.  Hands on live demonstrations of advanced development techniques provide real-time, practical guidance.

Part of this course focuses on the attendees’ specific issues.  The instructor will ask for questions and problems the attendees may be encountering.  He will discuss the best and most current techniques for dealing with those issues and provide practical guidance.

Instructor: Rob Oshana, Senior Director, Software R&D, Microcontrollers Freescale

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Rob Oshana
Senior Director, Software R&D, Microcontrollers
Freescale
Training & Development San Francisco Marriott Marquis Wednesday, July 12
8:00am to 12:00pm

From IoT to industrial controls, embedded systems are the key to optimizing performance and power. In fact, embedded systems (A combination of computer hardware, software and sometimes additional mechanical parts.) are the driving force behind IoT. Most electronic devices, our cell phones, microwaves, network routers, automobiles, and industrial controls are controlled by embedded software.  Each of these embedded systems is unique and highly customized to the specific application.

This course will provide practical techniques and guidelines for developing embedded system software.  We will overview the basic components of embedded and real-time systems, discuss the basics of interacting with and controlling peripherals,  the different types of embedded software architectures, how to use a real-time operating system and basic scheduling algorithms, examples of optimizing embedded software for performance, memory, and power, what goes into developing safety critical embedded systems, a brief overview of multicore embedded systems, and some examples of how to use embedded system development tools. 

We will also look at how embedded systems are driving the Internet of Things (IoT) and show some examples of connectivity and applications for IoT.  We will offer live demonstrations of IoT embedded systems.

Instructor: Rob Oshana, Senior Director, Software R&D, Microcontrollers Freescale

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Advanced Manufacturing San Francisco Marriott Marquis Monday, July 10
12:00pm to 7:30pm

imec Technology Forum USA is imec’s high-tech event, offering a unique research and innovation perspective on the emerging opportunities in semiconductor technology and smart electronics systems.

This year’s half-day conference will focus on exciting research advances in next-generation semiconductor and system scaling.

This is an invitation only event: Contact imec

View the complete agenda: Visit imec Technology Forum 2017

ITF2017 USA highlights –

  • A must-attend keynote by Martin van den Brink, President & CTO, ASML, one of the world’s leading manufacturers of chip-making equipment;

  • Imec experts on breakthrough research in semiconductor technology scaling, neuromorphic computing based on hardware/software co-optimization, chip fingerprints based on deeply scaled transistors increase HW security, and more...;

  • Insiders’ knowhow, views and perspectives for the future of the IC industry;

  • Premium networking with 300+ industry experts, decision makers and visionaries.

The Imec Technology Forum (ITF) is an initiative of imec, the world-leading R&D and innovation hub in nanoelectronics and digital technology, leveraging the expertise of nearly 3,500 top scientists and engineers and a partner network including the world’s leading companies in ICT, communication and health care.

ITF USA is organized in conjunction with SEMICON West and supported by SEMI.

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Standards San Francisco Marriott Marquis Wednesday, July 12
8:00am to 2:00pm

The Global Information & Control Technical Committee develops standards that pertain to the interface of manufacturing tools to each other, to control computers, or to human operators, for the purpose of transferring commands and data used during the manufacturing process.

Task Force Meetings

I&C Task Forces will meet Monday, July 10 through Tuesday, July 11.

Monday, July 10

  • Diagnostic Data Acquisition (DDA) TF
  • I&C GCS (By Invitation Only)
  • I&C NA Leadership
  • PCS TF

Tuesday, July 11

  • Energy Saving Equipment Communication (ESEC) TF
  • GEM 300 TF
  • Graphical User Interfaces (GUI) TF
  • Sensor Bus TF
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When it comes to staying connected with industry happenings, SEMI is the place to be. SEMICON West is the annual flagship, but SEMI also offers an abundant catalogue of additional industry events and conferences to keep you informed and in the loop—all year long, and all around the world. Mark your calendar now!

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Katherine (Kathy) S. Winter
Vice President
Automated Driving Group
Keynotes & Executive Panels Yerba Buena Theater Wednesday, July 12
9:35am to 10:05am

As autonomous cars prepare to hit the roads, a tidal wave of data will come with them. Today, the average person generates around 650 megabits of data per day. By 2020, an autonomous vehicle will produce approximately 4 terabytes of data per day. Autonomous vehicles will need to navigate new environments, continuously update high-precision maps, anticipate what other cars around them will do and learn from the collective knowledge of other autonomous vehicles, which will be stored in the cloud. New technologies, like 5G, will enable data to move back and forth between cars, the cloud, and all the “things” around them seamlessly. Kathy Winter will explore what this means for the automotive industry – and specifically autonomous driving - and how Intel is partnering with the ecosystem to solve these problems.

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Tetsuro Higashi
Corporate Director and Corporate Advisor
TEL
Keynotes & Executive Panels Yerba Buena Theater Tuesday, July 11
9:05am to 9:35am

Semiconductor devices have achieved tremendous performance as an individual component such as the memory, logic and analog, making it possible to have information storages more than an entire library, mathematical calculations much faster than a team of geniuses and pixel resolutions exceeding human vision.

In addition to improving the performance of specific devices individually, the semiconductor industry is now expected to provide innovation as a system for three layers of information technology: the interface between the real world and information networks; the intelligence to enhance creativity and efficiency; and the infrastructure for both communicating and storing information.

With regards to inspiration and creativity, it would be future rather than the past that the semiconductor industry creates the intelligence to extend capability of human being.  Human intelligence empowered by artificial intelligence will be the biggest paradigm shift in human history. Problem-finding, experience-based, flexible computing systems such as neuromorphic devices may be the missing link between conventional semiconductors and the intelligent systems of the future.

Since the author began his career 40 years ago, venture spirits with highly-motivated intelligence, healthy competition and global collaboration have been unchanged success factors of our industry, and it will be. As members of our industry, each of us contributes to accelerate human wellness for sustainable and responsible global growth.

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Thomas Caulfield, Ph.D.
Senior Vice President & General Manager, Fab 8
GLOBALFOUNDRIES
Keynotes & Executive Panels Yerba Buena Theater Tuesday, July 11
9:35am to 10:05am

 

Dr. Thomas Caulfield is senior vice president and general manager of the company’s latest leading-edge 300mm semiconductor wafer manufacturing facility (Fab 8), located in Saratoga County, NY. Caulfield, who joined the company in May 2014, leads the operations, expansion and ramp of semiconductor manufacturing production at Fab 8, where GLOBALFOUNDRIES supports customers on the world’s most advanced semiconductor manufacturing technology platforms including 28 nanometer (nm), 20nm, and 14nm. 

Caulfield brings a track record of results through an extensive career spanning engineering, management and global operational leadership with leading technology companies. Most recently, Caulfield served as president and chief operations officer (COO) at Soraa, the world’s leading developer of GaN on GaNTM (gallium nitride on gallium nitride) solid-state lighting technology. Prior to Soraa, Caulfield served as president and COO of Ausra, a leading provider of large-scale concentrated solar power solutions for electricity generation and industrial steam production. Before that, Caulfield served as executive vice president of sales, marketing and customer service at Novellus Systems, Inc. 

Prior to that, Caulfield spent 17 years at IBM in a variety of senior leadership roles, ultimately serving as vice president of 300mm semiconductor operations for IBM’s Microelectronics Division, leading its state-of-the-art wafer fabrication operations in East Fishkill, NY.

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W Hotel Tuesday, July 11
5:00pm to 9:00pm

It's our 50th Anniversary Celebration! Join us at SEMICON West 2017.

This year, Leti will share its vision for preparing your digital and energy transition: Tomorrow's technological challenges for microelectronics. We hope that you'll be able to celebrate Leti’s 50 years of innovation with us in San Francisco.

Click here for a full conference agenda and to learn more about this upcoming event! 

We'll see you there! 

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Standards San Francisco Marriott Marquis Tuesday, July 11
2:00pm to 5:00pm

The Global Liquid Chemicals Technical Committee identifies and develops consensus-based standards fulfilling the technical needs of the industry for liquid chemicals and liquid chemical distribution.

Task Force Meetings

Liquid Chemicals Task Forces will meet Monday, July 10 through Tuesday, July 11.

Monday, July 10

  • High Purity Liquid Assemblies & Systems TF
  • High Purity Polymer Material & Component (F57) TF
  • Ultra Pure Water (UPW) TF

Tuesday, July 11

  • Chemical Analytical Methods (CAM) TF

 

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Connect to Technology, Materials Moscone West, TechXPOT West Tuesday, July 11
2:00pm to 4:00pm

Hosted by the SEMI Chemical & Gas Manufacturers Group (CGMG)

As leading-edge devices move into 10nm and sub-10nm nodes, the challenge of maintaining a supply chain that can provide in-spec and in-ship-to-control materials increases dramatically. In

this session, technology and thought leaders from device, materials, and metrology companies will dig into tough questions and provide some clarity and guidance in order for the industry to realize the next generation of devices.

  • What new metrology capabilities and ranges are needed?
  • Considering that electronic materials may become an increasingly smaller share of revenues, what changes are needed to the incoming raw material supply?
  • How do we identify “rogue” impurities not currently measured or reported?
  • Are there industry-standardized processes to be improved or created?
  • When the best metrology tool is the device, can customers help identify improvement opportunities?
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Standards San Francisco Marriott Marquis Wednesday, July 12
2:00pm to 5:00pm

The Global Metrics Technical Committee focuses on standards, specifications, and practices used as the basis for comparative performance measurements of equipment, materials, components, or manufacturing operations to enhance the manufacturing capability of the semiconductor and related industries.

Task Force Meetings

Metrics Task Forces will meet Tuesday, July 11 through Wednesday, July 12.

Tuesday, July 11

  • EMC TF
  • ESD/ESC TF
  • Equipment Cost of Ownership (E-COO) TF

Wednesday, July 12

  • Equipment RAMP Metrics TF
  • RF Measurements TF
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Standards San Francisco Marriott Marquis Thursday, July 13
3:30pm to 5:30pm

The Global MEMS/NEMS Technical Committee is currently working on topics including Wafer Bonding Alignment Targets; Step-Height Measurements of Thin, Reflecting Films using an Optical Interferometer; and Ultra High Purity Microscale Fluidic Systems for Use in Scalable Process Environments.

Task Force Meetings

MEMS/NEMS Task Forces will meet Thursday, July 13.

Thursday, July 13

  • MEMS Microfluidics TF
  • Joint MEMS & Sensors Industry Group (MSIG), MEMS Substrate, MEMS Material Characterization TFs
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Training & Development San Francisco Marriott Marquis Wednesday, July 12
3:30pm to 6:30pm

In 2017, we’re broadening the scope of our career development efforts to attract a full range of employment opportunities in microelectronics — from internships all the way up to the senior management level. At the all-new MicroE Career Development & Recruitment Forum our goal is to drive awareness of industry opportunities and inspire you to consider a career in microelectronics — or perhaps move further along your existing industry career path at a new company, or even in an entirely new industry sector. At the one-day program, you will:

  • Meet representatives of key industry players and gain valuable information and insights into career opportunities at some of the leading names in microelectronics.
  • Learn about the latest industry trends in SMART Auto, SMART MedTech, SMART Manufacturing, and IoT at expert panel presentations.
  • Hear personal, hands-on success stories of engineers currently working in the field, and gain insights from a Q&A session.
  • Participate in conversational and fun sessions designed to help you prepare for working in the industry.
  • Network with potential peers and employers.
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Standards San Francisco Marriott Marquis Tuesday, July 11
10:00am to 12:00pm

The Global Microlithography Technical Committee explores, evaluates and formulates consensus-based microlithography specifications that through voluntary compliance will enhance the manufacturing capability of the semiconductor industry.

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Connect to Applications, SMART Manufacturing Moscone North, TechXPOT North Tuesday, July 11
2:00pm to 4:15pm

Co-Hosted by the SEMI Smart Manufacturing Advisory Council

While the electronics sector is already well experienced with automation and data analysis to improve yields and reduce costs, the current increase in the complexity of manufacturing processes, the improvements in sophisticated data management tools, and the increasingly inter-related value chain are now creating new opportunities for significantly improving performance, but also new challenges in putting all the parts together.  We will look at the future vision for smart manufacturing across our industry, the key challenges to get there, the practicalities of predictive maintenance and predictive simulation, and the issues and solutions for communicating the needed data efficiently and securely across suppliers and customers for the benefit of all. 

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Keynotes & Executive Panels Yerba Buena Theater Tuesday, July 11 10:05am
Industry Outlook San Francisco Marriott Marquis Tuesday, July 11
10:00am to 12:00pm

Known as Silicon Island of the East, the state of Penang, Malaysia, is home to more than 300 multi-national corporations as well as thousands of small-to-midsized enterprises supporting its burgeoning industrial ecosystem.  With 40-plus years of industrial development as a foundation, Penang is on the move. The state enhances its international city status daily and is increasingly seen as a location of choice for investors, tourists, and those who desire sustainable living.

Penang is not only the electronics hub of Southeast Asia, but also a preferred location for an array of fast-growing industries and services, including semiconductors, medical devices, LED, avionics, automation, and Global Business Services (GBS).

Join us and hear why Penang has become a destination of choice for investment, technology, and business. In conjunction with SEMICON West 2017, Invest Penang’s informative session will fill in all the details surrounding Penang's unique value proposition and answer any question you may have.

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Standards San Francisco Marriott Marquis Wednesday, July 12
11:00am to 12:00pm

The Global Photovoltaic Materials Committee develops consensus measurement methods, specifications, guidelines, and practices that promote mutual understanding and improved communication between users and suppliers of photovoltaic materials and related metrology equipment to enhance manufacturing efficiency.

Task Force Meetings

PV Task Forces will meet Wednesday, July 12.

Wednesday, July 12

  • International PV Analytical Test Methods, Metrology, and Inspection TF
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Standards San Francisco Marriott Marquis Wednesday, July 12
10:30am to 12:00pm

The Global Physical Interfaces and Carriers Technical Committee develops mechanical, electrical, and special equipment specifications and material movement integration, including substrate support and containment structures.

 

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Keynotes & Executive Panels Yerba Buena Theater Wednesday, July 12
9:20am to 9:35am
Standards San Francisco Marriott Marquis Tuesday, July 11
1:00pm to 5:00pm

The Global Silicon Wafer Technical Committee develops specifications and guides for silicon wafers, test methods for silicon wafer quality and geometry, shipping box related topics, wafer ID related topics, and business related topics to support smooth communication between silicon suppliers and customers.

Task Force Meetings

Silicon Wafer Task Forces will meet Monday, July 10.

Monday, July 10

  • International Advanced Wafer Geometry TF
  • International Automated Advanced Surface Inspection TF
  • International SOI TF
  • Joint International Methods, Polished Wafer, Epi Wafer, Terminology TFs
  • Silicon Wafer GCS (By Invitation Only)
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Connect to Applications, SMART Automotive Moscone North, TechXPOT North Wednesday, July 12
10:30am to 12:35pm

Automobile electronics is driving new chip demand. The semiconductor and automotive industries are changing the driving experience with technical advances enabling self-driving cars, Advanced Driver Assist (ADAS), and more. Sensors, telematics, artificial intelligence, embedded software, and machine learning are driving new features and capabilities in automotive systems for powertrain control, connectivity, mobility, security, safety, and infotainment. This forum will explore how smart automotive applications are changing the world. We will cover the key technologies, performance upgrades, and market trends shaping the future of Smart Automotive.

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Connect to Applications, SMART Automotive Moscone North, TechXPOT North Wednesday, July 12
2:00pm to 4:00pm

Session Partner: SAE International

Automotive industry OEMs and first-tier players look to the semiconductor industry for its expertise, speed, and agility in providing integrated electronic solutions focused on ever-increasing customer requirements. As connected vehicles demand more intelligence, speed, and memory to run ADAS, autonomous and automated driving, IoT, and cloud-based communications, the auto industry needs to prepare for what’s around the corner. In the coming five years, just how fast and how often will our vehicles communicate? How fast will the processors operate? How much memory will be available in the smallest footprint? And what will be the production requirements on all the parts and pieces to make an integrated electronics system run flawlessly? At this session, our integration experts will provide insights into the future of electronic technologies as they pertain to the automotive industry. 

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Connect to Applications, SMART Automotive, SMART Journey, Meet the Expert Theater, MEMS & Sensors SMART Journey, Meet the Expert Theater, Moscone West Tuesday, July 11
10:30am to 3:00pm

More sensors, more sensor fusion, and much more integrated intelligence are changing almost everything about automotive electronics, and significantly increasing the value of semiconductors and software in the car. But challenges remain, from meeting automotive-level traceablity demands to adding high speed connectivity, all with the needed safety and security standards. 

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Connect to Applications, SMART Automotive, SMART Journey, Meet the Expert Theater SMART Journey, Meet the Expert Theater, Moscone West Thursday, July 13
10:30am to 12:30pm

More sensors, more sensor fusion, and much more integrated intelligence are changing almost everything about automotive electronics, and significantly increasing the value of semiconductors and software in the car. But challenges remain, from meeting automotive-level traceablity demands to adding high speed connectivity, all with the needed safety and security standards. 

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SMART Manufacturing, SMART Journey, Meet the Expert Theater SMART Journey, Meet the Expert Theater, Moscone West Wednesday, July 12
3:00pm to 4:30pm
Connect to Technology, SMART Manufacturing, SMART Journey, Meet the Expert Theater SMART Journey, Meet the Expert Theater, Moscone West Wednesday, July 12
1:30pm to 3:00pm

Scaling in 2D and 3D, and more diverse, lower volume markets present new challenges for semiconductor manufacturing. Meanwhile, the advances in low cost compute power and other improved technologies that enable artificial intelligence and other smarter processing provide new opportunities to improve traceability for defects and speed ramp to yield, while also improving sustainability. All this will also require collaborative efforts across the extended supply chain. 

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James. C. Morgan
Chairman Emeritus
Applied Materials
Keynotes & Executive Panels Yerba Buena Theater Wednesday, July 12
9:05am to 9:20am

James C. Morgan
Chairman Emeritus, Applied Materials

James C. Morgan ran Applied Materials Inc. for nearly three decades — one of the longest tenures of any Fortune 500 CEO. The company was near bankruptcy when he joined; when he retired as Chairman in 2009 Applied was a multi-billion dollar global leader with more than 15,000 employees. Quite an achievement for a former Cayuga, Indiana farm boy who grew up herding cows, harvesting corn, and working in his family’s vegetable cannery. Along the way, Jim collected and tested his management principles in such realms as the military, the diversified conglomerate Textron, in venture capital, on corporate boards and government commissions, and in the non-profit arena. He has served on Boards of the Nature Conservancy. Recently he and his wife, Becky, founded the Northern Sierra Partnership, which fosters collaboration among conservation organizations in order to preserve and restore one of the world’s great
mountain ranges.

Jim also served.as Vice Chair of President George W. Bush’s President’s Export Council, an adviser to President Bill Clinton and Congress on U.S.-Pacific trade and investment policy, and The National Committee on Semiconductors for H.W. Bush. He has BME and MBA from Cornell University, and he co-authored the 1991 book, Cracking the Japanese Market: Strategies for Success in the New Global Economy. 

Among Jim’s many recognitions are the Semiconductor Industries Award, the IEEE Robert N. Noyce Medal; the Silicon Valley Leadership Group Lifetime Achievement; the Global Humanitarian Award;  and the National Medal of Technology and Innovation by President Bill Clinton.

His new book, Applied Wisdom: Bad News Is Good News and Other Insights That Can Help Anyone Be a Better Manager (November, 2016) is published by Chandler Jordan Publishing.

Jim will be signing copies of his book at Booth #5630 on July 11 and July 12 from 10 am to 5 pm at the Moscone Center North Hall.

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Connect to Technology, Advanced Manufacturing Moscone West, TechXPOT West Tuesday, July 11
10:30am to 12:30pm

Hosted by the Semiconductor Components, Instruments & Subsystems (SCIS) Special Interest Group

Manufacturing sub-10nm manufacturing is a reality in today’s manufacturer of devices but face major issues reaching entitled yields due to defects. Finding those defects, tracing them to their source, and eliminating them hinders from achieving any level of yield management that assure economic scales of investments. That in itself has led to focusing on one of the last frontiers never before reflected in the search of these defects -- sub-components. Bringing awareness to the correlation of particle or defect generation to these critical components have become a true priority. In this session, IDMs will share their perspectives on the impact of component defectivity and what they are doing to address them.  Furthermore, playing a similarly critical role and facing similar challenges, OEMs will share their insight on this critical issue and what they are doing with their component suppliers to solve this problems. These stakeholders are working together towards creating measurable and tangible solutions by characterizing important parameters affecting processes and inevitably impact yields and offer ways to measure and manage them. Presenters in this session will offer their insight as well as answer questions on how this effort can bring meaningful improvements and impact to this last frontier of the industry.

 

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Receptions AT&T Park Tuesday, July 11
5:00pm to 10:00pm

Climb aboard the shuttle to AT&T Park and join us in at the Virgin America Club Level for hors d’oeuvres and the beverage — hard or soft — of your choice. The Summerfest at AT&T Park takes place in conjunction with the Major League Baseball All-Star Game, which you’ll be able to view live as it happens on the stadium jumbo-tron as well as on large screens throughout the Virgin America Club Level. It’s a great opportunity to network with colleagues and customers after a long day on the Expo floor. You won’t want to miss it:

  • Network with peers, partners, and customers from across the industry.
  • Visit the Giants’ museum loaded with baseball memorabilia — from New York to San Francisco.
  • Tour AT&T Park and the Giants’ dugout and batting cage to take a practice swing (limited availability).
  • See the All-Star Game live and large!

Admission to the Summerfest at AT&T Park is included in a SEMICON West All-In Pass or available to purchase a la carte. All-In Pass holders will receive their ticket with their badge when they check in at the "VIP, Press, All-In Pass" registration desk in Moscone West Hall Lobby.  Attendees who purchase their ticket a la carte may pick it up from 12:00 to 5:00pm on Tuesday, July 11 at the Summerfest Ticket Desk in the Moscone West Hall Lobby. 

Complimentary shuttle services, in addition to ride sharing, taxis, and public transportation can take you from Moscone West to Summerfest at AT&T Park. Learn more.

Coat and bag check services will be available at AT&T Park on the Club Level. Daypacks and computer bags are allowed, luggage may not be brought into the park. 

Do you want to attend this networking event? Register for SEMICON West

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Test San Francisco Marriott Marquis Wednesday, July 12
8:00am to 5:00pm

Test Vision 2020 is today's premier workshop for semiconductor and system test experts with a vision towards the future of test. It is a highly anticipated gathering of providers and users of test IP and equipment, all converging to engage with leaders in the field and discuss coming trends and requirements. The conference typically has hundreds of participants and is held in conjunction with SEMICON West, assuring access to a wide range of expertise and experience.

This year’s workshop theme is Fast-Track to a Smarter Test. The growth in autonomous driving and everything connected is increasing demand for automotive semiconductors and putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. Greater computational power coupled with increased analog and sensor content will force changes in test strategies due to more advanced packaging, heterogeneous integration, higher-performance analog, and increasing RF frequencies. To address these challenges, every tool in the arsenal must be brought to bear: increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware.

Thank you to our sponsors

Platinum: Advantest, Astronics Test Systems, Cohu, Mentor, and Teradyne

Gold: FormFactor, Optimal+, Pickering Interfaces and Xcerra

Silver: National Instruments and Reid-Ashman Manufacturing

Industry Sponsor: Semiconductor Wafer (SW) Test Workshop

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Test San Francisco Marriott Marquis Thursday, July 13
8:30am to 3:30pm

Test Vision 2020 is today's premier workshop for semiconductor and system test experts with a vision towards the future of test. It is a highly anticipated gathering of providers and users of test IP and equipment, all converging to engage with leaders in the field and discuss coming trends and requirements. The conference typically has hundreds of participants and is held in conjunction with SEMICON West, assuring access to a wide range of expertise and experience.

This year’s workshop theme is Fast-Track to a Smarter Test. The growth in autonomous driving and everything connected is increasing demand for automotive semiconductors and putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. Greater computational power coupled with increased analog and sensor content will force changes in test strategies due to more advanced packaging, heterogeneous integration, higher-performance analog, and increasing RF frequencies. To address these challenges, every tool in the arsenal must be brought to bear: increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware.

Thank you to our sponsors

Platinum: Advantest, Astronics Test Systems, Cohu, Mentor, and Teradyne

Gold: FormFactor, Optimal+, Pickering Interfaces and Xcerra

Silver: National Instruments and Reid-Ashman Manufacturing

Industry Sponsor: Semiconductor Wafer (SW) Test Workshop

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We think you’ll agree...together we all put on a great show!

Thank you for coming to collaborate and connect at SEMICON West 2017. Your contribution to this year’s Expo is greatly appreciated! We hope you gained new insights and made valuable connections to drive your business forward. And we hope to see you again next year. 

Mark Your Calendars

It’s not too early to start planning. We look forward to seeing you in San Francisco again next year, July 10-12, 2018.

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Connect to Technology, Advanced Manufacturing Moscone West, TechXPOT West Thursday, July 13
10:30am to 12:30pm

With 7nm phasing into production by the end of 2017 — after many delays — EUVL may not emerge as the hoped for savior. While some players are using EUVL at 10nm, several infrastructure issues remain unresolved. Aside from the actual technical solutions that still need to be perfected, economics will ultimately decide adoption rates. This session will discuss the economics and the road ahead as the industry places its bets on lithography moving from 7nm to 5nm.

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Connect to Technology, Advanced Manufacturing Moscone West, TechXPOT West Thursday, July 13
2:00pm to 4:00pm

The semiconductor industry is heading towards high-volume production at 7nm by the end of 2017, and planning is underway for 5nm and even 3nm processes and fabs. However, the economics of traditional scaling have become crippling, forcing some to pursue alternatives to density scaling. This session addresses the challenges and trade-offs chip makers need to consider as they map out their scaling strategies.

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Standards San Francisco Marriott Marquis Wednesday, July 12
3:00pm to 5:00pm

The Global 3DS-IC Technical Committee promotes mutual understanding and improved communication between users and suppliers of 3DS-IC materials, carriers, equipment, automation systems and devices.

Task Force Meetings

3DS-IC Task Forces will meet Wednesday, July 12.

Wednesday, July 12

  • 3DS-IC Bonded Wafer Stacks TF
  • 3DS-IC Inspection & Metrology TF
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Standards San Francisco Marriott Marquis Monday, July 10
10:00am to 12:00pm

The Global Traceability Technical Committee develops consensus-based standards to enable full traceability of materials and other factory resources in semiconductor manufacturing. This include marking and identification techniques, encode/decode methods, inter-company exchange of information, and characteristics of marking/reading sub-systems needed by the industry.

Task Force Meetings

Traceability Task Forces will meet Monday, July 10.

Monday, July 10

  • T5 Revision TF
  • Traceability 5-Year Review TF
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David Anderson
President, Americas
SEMI
Ajit Manocha
President & CEO
SEMI
Keynotes & Executive Panels Yerba Buena Theater Tuesday, July 11
9:00am to 9:05am
David Anderson
President, Americas
SEMI
Ajit Manocha
President & CEO
SEMI
Keynotes & Executive Panels Yerba Buena Theater Wednesday, July 12
9:00am to 9:05am
Connect to Applications, MEMS & Sensors, Connect to Technology Moscone North, TechXPOT North Tuesday, July 11
10:30am to 12:45pm

Co-hosted by MEMS & Sensors Industry Group

As use of data from MEMS and sensors disrupts most major sectors –from smart autos and smart manufacturing to smart cities and smart health monitoring—it’s also disrupting the MEMS sector as well. The new growth from these emerging markets is generating demand for new approaches, more integrated intelligence, and more competition to capture the value in these applications. We’ve invited some industry thought leaders to discuss these market trends, and the emerging developments in key areas of piezoelectric sensing, intelligence at the edge, intelligence in product development, and hybrid integration of sensors on flexible substrates.  

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Connect to Applications, IoT, MEMS & Sensors San Francisco Marriott Marquis Tuesday, July 11
2:00pm to 4:00pm

Organized by SEMI, IEEE Santa Clara Valley Section & the IEEE Computer Society

IoT devices collect data from or send data to the physical world. Microcontrollers, MEMS, sensors, and actuators form the building blocks of IoT device architecture. In recent years, there has been an explosive growth in the field of IoT devices. This session will focus on state-of-the-art IoT device platforms and their potential in IoT applications.

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Connect to Applications, IoT, MEMS & Sensors San Francisco Marriott Marquis Tuesday, July 11
10:30am to 12:30pm

Organized by: SEMI, IEEE Santa Clara Valley Section & the IEEE Computer Society

IoT devices typically stream large amounts of data — Big Data — to the cloud for storage. Data analytics enables the processing of stored data in order to obtain useful information for decision-making. Such intelligence provides competitive advantages and results in business benefits, such as more effective marketing and increased revenue generation. This session will focus key IoT applications, including solutions for home automation, smart cities, industrial monitoring, medical and healthcare, environmental monitoring, agriculture, and more.

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